(kicad_pcb
	(version 20260206)
	(generator "pcbnew")
	(generator_version "10.0")
	(general
		(thickness 1.6)
		(legacy_teardrops no)
	)
	(paper "A4")
	(layers
		(0 "F.Cu" signal)
		(4 "In1.Cu" signal)
		(6 "In2.Cu" signal)
		(2 "B.Cu" signal)
		(9 "F.Adhes" user "F.Adhesive")
		(11 "B.Adhes" user "B.Adhesive")
		(13 "F.Paste" user)
		(15 "B.Paste" user)
		(5 "F.SilkS" user "F.Silkscreen")
		(7 "B.SilkS" user "B.Silkscreen")
		(1 "F.Mask" user)
		(3 "B.Mask" user)
		(17 "Dwgs.User" user "User.Drawings")
		(19 "Cmts.User" user "User.Comments")
		(21 "Eco1.User" user "User.Eco1")
		(23 "Eco2.User" user "User.Eco2")
		(25 "Edge.Cuts" user)
		(27 "Margin" user)
		(31 "F.CrtYd" user "F.Courtyard")
		(29 "B.CrtYd" user "B.Courtyard")
		(35 "F.Fab" user)
		(33 "B.Fab" user)
		(39 "User.1" user)
		(41 "User.2" user)
		(43 "User.3" user)
		(45 "User.4" user)
	)
	(setup
		(stackup
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 1"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In1.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 2"
				(type "core")
				(thickness 1.24)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In2.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 3"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 4"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In1.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 5"
				(type "core")
				(thickness 1.24)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In2.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 6"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 7"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In1.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 8"
				(type "core")
				(thickness 1.24)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In2.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 9"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 10"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In1.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 11"
				(type "core")
				(thickness 1.24)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In2.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 12"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 13"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In1.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 14"
				(type "core")
				(thickness 1.24)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In2.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 15"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 16"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In1.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 17"
				(type "core")
				(thickness 1.24)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In2.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 18"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 19"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In1.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 20"
				(type "core")
				(thickness 1.24)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In2.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 21"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 22"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In1.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 23"
				(type "core")
				(thickness 1.24)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In2.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 24"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 25"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In1.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 26"
				(type "core")
				(thickness 1.24)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In2.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 27"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 28"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In1.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 29"
				(type "core")
				(thickness 1.24)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In2.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 30"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(copper_finish "None")
			(dielectric_constraints no)
		)
		(pad_to_mask_clearance 0)
		(allow_soldermask_bridges_in_footprints no)
		(tenting
			(front yes)
			(back yes)
		)
		(covering
			(front no)
			(back no)
		)
		(plugging
			(front no)
			(back no)
		)
		(capping no)
		(filling no)
		(aux_axis_origin 44.62 38.272)
		(grid_origin -68.998 14.87)
		(pcbplotparams
			(layerselection 0x00000000_00000000_55555555_5755f5ff)
			(plot_on_all_layers_selection 0x00000000_00000000_00000000_00000000)
			(disableapertmacros no)
			(usegerberextensions no)
			(usegerberattributes yes)
			(usegerberadvancedattributes yes)
			(creategerberjobfile yes)
			(dashed_line_dash_ratio 12)
			(dashed_line_gap_ratio 3)
			(svgprecision 4)
			(plotframeref no)
			(mode 1)
			(useauxorigin no)
			(pdf_front_fp_property_popups yes)
			(pdf_back_fp_property_popups yes)
			(pdf_metadata yes)
			(pdf_single_document no)
			(dxfpolygonmode yes)
			(dxfimperialunits yes)
			(dxfusepcbnewfont yes)
			(psnegative no)
			(psa4output no)
			(plot_black_and_white yes)
			(sketchpadsonfab no)
			(plotpadnumbers no)
			(hidednponfab no)
			(sketchdnponfab yes)
			(crossoutdnponfab yes)
			(subtractmaskfromsilk no)
			(outputformat 1)
			(mirror no)
			(drillshape 1)
			(scaleselection 1)
			(outputdirectory "")
		)
	)
	(footprint "Connector_PinSocket_2.54mm:PinSocket_1x01_P2.54mm_Vertical"
		(layer "F.Cu")
		(uuid "23ffbf1d-9224-4d9c-b40d-a61e708df406")
		(at -95.414 52.97)
		(descr "Through hole straight socket strip, 1x01, 2.54mm pitch, single row (from Kicad 4.0.7), script generated")
		(tags "Through hole socket strip THT 1x01 2.54mm single row")
		(property "Reference" "J9"
			(at 0 -2.77 0)
			(layer "F.SilkS")
			(uuid "8d895ef2-a235-4a88-9672-2dd4327048db")
			(effects
				(font
					(size 1 1)
					(thickness 0.15)
				)
			)
		)
		(property "Value" "Conn_01x01_Socket"
			(at 0 2.77 0)
			(layer "F.Fab")
			(uuid "dbd8838d-58c7-4017-83e5-d836a4ac49b7")
			(effects
				(font
					(size 1 1)
					(thickness 0.15)
				)
			)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
			(uuid "8918cfd6-1e7b-4cf3-a8c6-af3f5c631b89")
			(effects
				(font
					(size 1.27 1.27)
				)
			)
		)
		(property "Description" "Generic connector, single row, 01x01, script generated"
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
			(uuid "506ce6b0-d01b-40e8-947a-0e9a1756f0a1")
			(effects
				(font
					(size 1.27 1.27)
				)
			)
		)
		(property "KiLib_Generator" "connector/pin_header_socket"
			(at 0 0 0)
			(layer "F.SilkS")
			(hide yes)
			(uuid "2184f280-1090-4f17-9b77-214c38d56fd6")
			(effects
				(font
					(size 1 1)
					(thickness 0.15)
				)
			)
		)
		(property ki_fp_filters "Connector*:*_1x??_*")
		(path "/2f005cfb-eaaa-4acc-992e-faf91d30027a/fab1e364-4984-44c7-af1d-bc2d62109c3b")
		(sheetname "/Code/")
		(sheetfile "Code.kicad_sch")
		(attr through_hole)
		(duplicate_pad_numbers_are_jumpers no)
		(fp_line
			(start -1.33 1.21)
			(end -1.33 1.33)
			(stroke
				(width 0.12)
				(type solid)
			)
			(layer "F.SilkS")
			(uuid "95b50c86-98b9-46f2-a8d5-23284a1d89c3")
		)
		(fp_line
			(start -1.33 1.33)
			(end 1.33 1.33)
			(stroke
				(width 0.12)
				(type solid)
			)
			(layer "F.SilkS")
			(uuid "ec7f3b3a-300a-4e60-a177-33f7331ff4cb")
		)
		(fp_line
			(start 0 -1.33)
			(end 1.33 -1.33)
			(stroke
				(width 0.12)
				(type solid)
			)
			(layer "F.SilkS")
			(uuid "4c5965b3-8cc8-4f1f-b030-5b6e3b6174a9")
		)
		(fp_line
			(start 1.33 -1.33)
			(end 1.33 0)
			(stroke
				(width 0.12)
				(type solid)
			)
			(layer "F.SilkS")
			(uuid "2babf007-2477-4594-9f10-3f2c671d4e4e")
		)
		(fp_line
			(start 1.33 1.21)
			(end 1.33 1.33)
			(stroke
				(width 0.12)
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